품질 Wifi7 모듈 & 와이파이 하로우 모듈 제조업체

The global smart street light market is undergoing a structural expansion. A report released by Research and Markets in January 2026 shows that the market is projected to grow from $35.6 billion in 2026 to $74.9 billion in 2030, representing a CAGR of 20.4%. Europe is accelerating the renovation of existing infrastructure driven by mandatory replacement policies, while emerging markets in the Asia-Pacific region are releasing incremental demand through urbanization. However, a overlooked fact is that market expansion does not equate to simpler communication solution selection. On the contrary, as the focus of renovation shifts from "new construction" to "existing infrastructure," the primary constraint on communication solutions changes from technical specifications to the question: "Can this road be dug?" The position of PLC (Power Line Carrier Communication) under this constraint is clear: the streetlights themselves are connected to the power line, the PLC uses the same cable as both a power supply and data channel, and the communication signal is transmitted along the existing line without the need for any additional communication cables. Europe: Policy mandates have created the most certain scenarios for upgrading existing PLC systems. Europe is the region with the strongest policy drive for smart street light upgrades globally. A 2026 report by Mordor Intelligence points out that the EU's Mercury Regulation 2024/1849 requires the complete phase-out of compact fluorescent lamps by December 2025 and linear fluorescent lamps by December 2026. These compliance deadlines directly triggered a surge in municipal tenders. Simultaneously, the EU requires the public sector to reduce energy consumption by 11.7% by 2030, transforming the transition to network-connected LED lighting from an "optional" to a "compliance necessity." The unique aspect of this policy window is that it targets "replacement of existing infrastructure" rather than "new construction." Many streetlights in Europe were installed decades ago, with intact power cables but missing communication cables. Adopting a solution requiring separate communication cabling would mean excavating or re-laying conduits along the entire route, resulting in unpredictable costs and time. The ability of PLCs to reuse existing power cables perfectly matches the policy's mandated time pressure with the construction constraints of upgrading existing infrastructure. German practice provides a reference: the LED upgrade of 48,000 streetlights in Munich, combined with adaptive dimming, reduced energy consumption by 93% during off-peak hours. For these types of projects, communication reliability is more important than bandwidth; the millisecond-level latency of PLCs and the engineering advantages of no-wiring are more significant than wireless solutions in this scenario. However, the European market also presents a strict cost scrutiny. Smart retrofitting costs between €300 and €500 per pole, while basic LED replacement only costs €150 to €200. This price difference means that the selection of PLC modules must withstand scrutiny regarding the question of "why not use wireless?" The answer lies not in technological superiority, but in the engineering certainty under existing wiring conditions : wireless solutions are affected by terrain and building obstructions in dense urban areas, requiring additional relay nodes in practical testing, while PLCs, assuming the power supply cable is intact, have a physically existing communication link.   China and Asia Pacific: Differences in PLC Positioning in Incremental Markets Data from China's smart light pole market presents a different picture. QYResearch statistics show that the global smart city light pole market sales reached approximately $412 million in 2025 and are projected to reach $796 million by 2032, representing a compound annual growth rate of 10.0%. Unlike Europe's "replacement of existing stock," China's growth is largely driven by new "multi-purpose" projects: light poles simultaneously serve functions such as lighting, monitoring, 5G micro base stations, and environmental monitoring. Communication solutions tend to favor fiber optic or wireless backhaul because the civil engineering of the light pole itself is already included, thus amortizing the marginal cost of laying separate communication cables. This means that the main opportunity for PLCs in the Chinese street lighting market lies not in "building new smart light poles," but in the niche scenario of "energy-saving retrofitting of existing road lighting." Many urban roads in China only have power cables in their lighting circuits, lacking communication lines. If only single-lamp control, dimming, and fault feedback are required, PLCs offer better engineering economics than rewiring. A study published in the 8th issue of *China Lighting Appliances* in 2026 points to this logic: traditional control modes are energy-intensive and difficult to maintain, while mainstream wireless communication solutions are easily affected by terrain obstruction in densely populated urban areas. PLCs, utilizing existing cables for data transmission, offer advantages such as low cost and reliable connection. The Southeast Asian market is in an earlier stage. In March 2026, Terengganu, Malaysia, installed the state's first 5G smart lamppost at the Kedebayan Market, integrating smart lighting, monitoring, environmental monitoring, and electric vehicle charging functions. These markets share common characteristics: real incremental demand, but projects are small-scale, budgets are fragmented, and there is a higher sensitivity to module costs than to brand premiums. In these markets, PLC modules are more likely to follow lighting solution providers overseas rather than independently building brand recognition.   The strategic position of the Qogrisys S130N-ISI in this landscape The product parameters of the S130N-ISI need to be understood within the context of the aforementioned market differences. It is based on the Leadcore VC6330, with an LCC package size of 20.6×12.6mm, supports both Q/GDW 11612 and IEEE 1901.1 protocols, and provides UART, PWM, GPIO, ADC, and SPI interfaces, integrating a built-in wire driver. According to official data from Leadcore regarding the VC6330 chip, application-layer communication rates can reach 1Mbps, with attenuation resistance exceeding 112dB, and a 99.99% communication success rate in actual projects. These parameters address the question of "whether it can be used," but the "usability" in different markets depends on the line conditions and system integration quality. The aging of the lines in European projects, the distribution of interference sources in Chinese projects, and the differences in construction specifications in Southeast Asian projects all affect the actual performance of the PLC. In street lighting scenarios, the value of the S130N-ISI lies not in promising "it will work immediately after installation," but in providing a hardware option that meets basic engineering requirements in three dimensions: protocol matching (Q/GDW 11612, IEEE 1901.1), size adaptation (20.6×12.6mm can be embedded in a single lamp controller), and interface integration (PWM dimming, ADC acquisition). One fact that requires careful consideration is that publicly available authoritative data on the actual global adoption rate of PLCs in smart streetlights is limited. What can be confirmed is that PLCs are one of the official options for smart streetlight connectivity, with academic research and engineering practice supporting their feasibility under specific conditions. However, conclusions such as "PLCs will dominate streetlight communication" lack data support. For engineering teams evaluating solutions, a more pragmatic approach is to test the wiring first, then select the modules. Only when the line impedance and signal-to-noise ratio are within reasonable ranges can the wiring-free advantage of PLCs translate into savings in construction time and costs; if test results are unsatisfactory, the costs of forcing PLC implementation may only become apparent during the commissioning phase.   Conclusion: The window of opportunity belongs to solution providers who clearly explain the "constraints". The global smart street light market's 20.4% CAGR provides a real window, but this window opens differently in different regions. In Europe, mandatory policies have created a definite demand for retrofitting existing infrastructure, where the wiring-free advantage of PLCs has the clearest engineering logic. In China, incremental growth is concentrated in the construction of new multi-functional light poles, where PLCs have opportunities in the energy-saving retrofitting of existing roads. In Southeast Asia, the early-stage market is testing the cost competitiveness of modules. In this context, the S130N-ISI isn't a "universal street light module," but rather a PLC hardware option that adapts to the needs of single-lamp controllers in terms of protocol, size, and interface. Its value lies not in the absolute values of its specifications, but in its compatibility with the specific project's wiring conditions. For the engineering team, this means resolving the "do we need to break the road?" question at the project initiation meeting, rather than discovering during the commissioning phase that line noise is causing communication success rates far below expectations. Testing the line first, then selecting the module—reversing this order might save you a quote, but cost you the entire road's commissioning time.  

I. The Real-World Coordinates of the Wi-Fi 8 Standard Progress Just two days ago, Qualcomm's Dragonwing platform released a signal at Network X 2026 – the Wi-Fi 8 gateway solution was launched. To understand this, we need to clarify the current standard stage of Wi-Fi 8. At the IEEE plenary meeting in Montreal in July 2026, the 802.11bn task force voted to submit Draft 2.0 to the working group for a vote, thus finalizing the core features of Wi-Fi 8. According to the timeline disclosed by ABI Research, Draft 3.0 voting is scheduled for January 2027, Draft 4.0/initial standards association voting is targeted for May 2027, final working group approval is set for March 2028, IEEE standards committee approval is expected for May 2028, and the Wi-Fi Alliance certification program is expected to launch in January 2028. The key implication of this timeline is that Wi-Fi 8 will still be in the draft standard stage in 2026, with certified products and large-scale commercialization not truly starting until 2028. However, chip platform and module solution providers have already significantly accelerated their product development pace. Broadcom was the first to release Wi-Fi 8 chipsets in October 2025, followed by MediaTek and Qualcomm. By September 2026, the Wi-Fi Alliance had already held its first Wi-Fi 8 pre-certification interoperability Plugfest in Beijing, Taipei, and California. While the standard has not yet been finalized, the industry's engineering preparations are already in full swing. II. The Differentiated Deployment Logic of Qualcomm's Dragonwing Platform Qualcomm's Dragonwing product portfolio, showcased at Network X 2026, presents a clear market segmentation strategy. designed for mainstream fiber broadband gateways . According to Qualcomm's official product briefing, the F8 integrates Wi-Fi 8 connectivity and native PON architecture support, targeting Home Gateway Units (HGUs) and Single Units (SFUs). Key specifications include: peak wireless capacity of 23Gbps, support for up to 750 concurrent clients, up to three-band operation and a 14-antenna configuration , flexible RF configuration allowing for a 5x5 mode or splitting into dual-band simultaneous 2x2+3x3 modes, and native support for GPON, XG-PON, and XGS-PON standards. The platform supports open-source middleware such as prplOS, OpenWRT, RDK, and OpenSync, and is equipped with a dedicated scanning radio frequency for automatic channel selection and radar detection. designed for high-end enterprise access points (APs) and flagship home routers . Its specifications are significantly improved: peak wireless capacity of 33Gbps, support for up to 1500 concurrent clients, up to five frequency bands and a 20-antenna configuration , integrated five-core CPU and Hexagon NPU, and support for edge AI inference. Developed in collaboration with GFiber, this platform, a Wi-Fi 8 Premium Gateway, aims to support symmetric 20Gig broadband services, redefining the gateway from a "connected device" to a "smart service platform." Meig Smart chose to launch its Wi-Fi 8 gateway solution on the N8 platform, officially announcing it at Network X 2026 on October 14th. The industry significance of this launch lies in the fact that the entire engineering transformation chain of a Wi-Fi 8 gateway, from chip platform to deliverable solution, has been fully demonstrated for the first time. For downstream customers, the Wi-Fi 8 gateway is no longer a distant concept "waiting for the standard to be finalized," but rather an evaluable chip base and a referenceable solution design. III. Generational Positioning of Qogrisys Gateway Module Product Line Although manufacturers are currently rushing to implement their strategies in advance, WiFi 7 and WiFi 6 remain the mainstays of shipments. They are more mature than WiFi 8 and are still the preferred choice. During this window of opportunity before the Wi-Fi 8 standard is finalized, gateway module solution providers need to strike a balance between technological foresight and market deliverability in their product strategies. Qogrisys's two main gateway module products are precisely designed to meet different levels of demand during this transition period. Wi-Fi 7 Platform: O2072PM and O2072PB The O2072PM is based on the Qualcomm FastConnect C7700 (QCC2072) chip, uses a standard M.2 Key E interface (22×30mm), and supports Wi-Fi 7 (802.11be) and Bluetooth 6.0. Its core capabilities include: tri-band 2.4/5/6GHz concurrent operation; the 6GHz band supports 320MHz channel bandwidth and 4096QAM modulation, with a peak rate of 5.8Gbps ; and it supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) , enabling millisecond-level switching when the link is interfered with. This module has completed driver adaptation for Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB is based on the same QCC2072 chip and uses a 15×13mm surface mount package, targeting space-constrained onboard integration scenarios. Wi-Fi 6E Platform: O2066PM and O2066PB The O2066PM is based on the Qualcomm QCA2066 chip and uses a standard M.2 2230 Key E interface (22×30×2.7mm), supporting Wi-Fi 6E (802.11ax) and Bluetooth 5.2. Key specifications include: tri-band 2.4/5/6GHz support, dual-band simultaneous (DBS) operation, and a maximum speed of 2975.6Mbps ; support for 2×2 MU-MIMO, 160MHz channel bandwidth, and dynamic frequency selection (DFS radar detection). The Bluetooth interface supports both UART/PCM and USB configurations. The module operates in a temperature range of -30℃ to +85℃ , exhibiting industrial-grade stability. In VR products, it has achieved a measured throughput of 2.1Gbit/s and has been designed into customer VR products, which were showcased at CES 2023. The O2066PB is based on the same QCA2066 chip, and its core capabilities are identical to the O2066PM; the difference lies in its package form. It uses a small SMT LGA package, measuring 13×15×2.3mm , targeting space-constrained onboard integration scenarios. Wi-Fi uses a PCIe interface, and Bluetooth uses a UART/PCM interface. Its operating temperature range is -30℃ to +70℃ , making it suitable for consumer-grade terminal devices. the O2072 series is logically consistent with the "high reliability connection" emphasized by Wi-Fi 8—Wi-Fi 7's MLO provides an engineering implementation of link redundancy, while Wi-Fi 8's Multi-AP Coordination (MAPC) extends the coordination scope from a single device to a multi-node network. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-end and mid-range gateways, Wi-Fi 6E's 6GHz band capability provides cost-sensitive customers with a "partial generational upgrade" option . IV. Generational Transition Logic Between Chip Platforms and Module Products From Wi-Fi 6E to Wi-Fi 7 and then to Wi-Fi 8, the technological evolution path of gateway modules shows a clear continuity. The core improvement of Wi-Fi 8 over Wi-Fi 7 lies not in peak speed . According to industry technical analysis, Wi-Fi 8 is compatible with Wi-Fi 7's 2.4/5/6GHz tri-band, 320MHz channel, and 4096QAM. Existing Wi-Fi 7 RF architectures can support these core features through firmware upgrades . Wi-Fi 8 offers approximately double the actual throughput and reduces P99 latency to about one-sixth of Wi-Fi 7. Its core value lies in reliability, coverage, and concurrency efficiency in high-density/long-distance scenarios , achieved through multi-AP collaboration, dynamic resource scheduling, and enhanced link design. Wi-Fi 7 addressed "speed," while Wi-Fi 8 addresses "stability." The eMLSR multi-link operation capability and tri-band concurrent architecture already possessed by the O2072 series from Qogrisys are engineering implementations on the Wi-Fi 7 platform. As the Wi-Fi 8 MAPC protocol stack and enhanced long-range response (ELR) features mature, module products based on the Wi-Fi 7 RF architecture have the engineering foundation to migrate to Wi-Fi 8 features at the hardware level . The core challenges lie in upgrading the software protocol stack and implementing multi-AP coordination functions. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-to-mid-range gateways, the 6GHz band capability of Wi-Fi 6E provides cost-sensitive customers with a "partial generational upgrade" option . V. Conclusion Qualcomm's Dragonwing platform was publicly launched as a Wi-Fi 8 gateway solution during Network X 2026, marking the transition of Wi-Fi 8 from the standard draft and chip prototype stages to the gateway product engineering stage . Meig Smart's solution release validates the transformation path from chip platform to deliverable gateway, and also indicates that the competitive pace among module solution providers has shifted from "following after the standard is frozen" to "parallel development during the standard draft stage." For gateway module solution providers, the core task at this stage is not to "get a head start" on the Wi-Fi 8 platform, but to accumulate transferable engineering capabilities on the Wi-Fi 7 and Wi-Fi 6E platforms. The experience of O2072PM / O2072P B in eMLSR multi-link operation, the accumulated RF engineering expertise in tri-band concurrent architecture, and the cost optimization path of O2066PM / O2066P B in the 6GHz band together constitute the product positioning for the transition to the Wi-Fi 8 era. From a longer-term perspective, Wi-Fi 8 redefines the gateway from a "wireless coverage device" to an "access node in a multi-AP coordinated network." This role change requires module solution providers to extend their capabilities beyond simple RF engineering and driver adaptation to system-level capabilities such as network topology planning, multi-node collaborative scheduling, and deployment scenario adaptation. During the standard window of 2026-2027, module solution providers' product strategies need to find a balance between "technological foresight" and "current deliverability"—Wi -Fi 7 modules serve current high-end gateway needs, Wi-Fi 6E modules cover cost-sensitive scenarios, and Wi-Fi 8 productization preparation needs to be quickly integrated as soon as the chip platform becomes available.  

I. 수용 논리는 바뀌었습니다. "설치되었든 아니든"에서 "시험된 경우에만 계산됩니다". 첸젠의 지붕 태양광 프로젝트는 수용 표준의 실질적인 업그레이드를 겪고 있습니다. 첸젠의 현지 엔지니어링 건설 표준 SJG 220-2026가 시행되었습니다.급속한 폐쇄를 위한 정확한 수치 지표를 설정합니다.: 종료 작업은 30초가 넘지 않아야 하며, 광전지 배열의 1미터 이내에 있는 전압은 80V 이하로 떨어져야 합니다.그리고 1미터 바깥의 전압은 30V 이하로 떨어져야 합니다.. 이것은 단순히 "빠른 폐쇄를 설치하는 것"으로 무시할 수 있는 것이 아닙니다. 현장에서의 수용 직원들은 먼저 모든 종료 트리거 포인트를 찾아낼 것입니다.화재 출구에서 논리의 일관성을 확인하는, 인버터 근처, 그리고 원격 제어 단말기에서; 그 다음 종료 장치와 구성 요소 사이의 대응을 확인; 마지막으로,도면에서 지정된 측정 지점에서 시간과 전압을 기록합니다., 프로젝트의 채택 된 버전의 내부 및 외부에서 배열 경계가 요구 사항을 충족하는지 확인합니다.단순히 "RSD는 재료 목록에 기록되어 있습니다"라고 명시하는 것은 더 이상 수용을 위해 충분하지 않습니다. 시스템 수준의 전압 제어 성능은 최종 기준입니다. 상하이 그룹 표준 T/ESETA 0000072026은 요구 사항을 더 정밀화했습니다.그리고 도달 가능한 경계의 외부 전압은 ≤30V이어야 합니다., 내부 전압은 ≤120V이고 출력 전력은 ≤1W일 수 있습니다. 또한 명확하게 "폐면은 부품 수준과 문자열 수준으로 나뉘어 있습니다.그리고 구성 요소 수준 솔루션은 인구 밀집 지역에서는 우선적으로 제공되어야 합니다.." 북아메리카 시장에는 더 엄격한 진입 장벽이 있습니다. NEC 690.12는 배열 경계를 벗어난 제어 선수가 30초 이내에 30V 이하로 떨어져야 한다고 요구합니다.그리고 그 경계 내에서 소방관들을 위한 전기 충격 보호는 PVHCS 장치 또는 전압 제한 방법을 통해 달성되어야 합니다..PLC 솔루션을 선택할 때, 칩의 변조 방법과 노이즈 면역은 시스템이 지원 할 수있는 구성 요소 수를 직접 결정합니다. II. 선스펙의 계층적 논리: 칩 준수 ≠ 모듈 인증 ≠ 전체 시스템 승인 이것은 스위치 제조업체와 모듈 구매자가 가장 쉽게 간과하는 중요한 문제입니다. 선스펙 얼라이언스의 "빠른 종료를 위한 통신 신호" 사양은 송신기와 수신기 사이의 통신 프로토콜을 정의합니다.송신기는 "운영 상태"에서 신호를 지속적으로 전송합니다., 그리고 수신기는 신호 손실을 감지하면 종료됩니다."선스펙 인증을 받은 표지판만이 선스펙 급속 정지 통신 신호 기능 사양의 완전하고 성공적인 구현을 증명합니다.제조업체 또는 다른 제3자로부터 "SunSpec 준수" 또는 "SunSpec 호환성"에 대한 주장은 SunSpec에서 발행한 인증서와 동등하지 않습니다.." 이것은프로토콜의 칩 지원, 모듈의 호환 테스트 통과 및 완전한 장치 인증은 세 개의 독립적인 검증 수준입니다. 모듈 수준 프로토콜 호환성은 첫 번째 장애물일 뿐이며, 전체 단위 수준에서의 UL 1741 및 CSA C22.2와 같은 안전 인증은 시장 진출의 여권입니다.이 이해는 차단기 제조업체의 선택 결정에 결정적입니다.   III. 모듈 선택에 대한 세 가지 엔지니어링 차원: 크기, 전력 소비 및 네트워크 용량 서킷 브레이커 제조업체에게는 칩 사양에 있는 "PLC 지원"과 "종합 라인 드라이버" 기능이 시작점일 뿐이다.솔루션이 대량 생산되고 구현될 수 있는지 결정하는 것은 모듈 수준에서의 엔지니어링 적응력입니다. 첫 번째 차원은 크기입니다.회로 차단기는 공간이 극히 제한된 각 태양광 모듈의 뒷판에 설치되어 있으며, 이 제한된 영역을 연결 상자와 케이블과 공유합니다.모듈의 패키지 크기는 직접 차단기 하우스의 설계 공간과 설치 방법을 결정Hisilicon PS0211 칩셋을 사용하는 PLC 모듈은 일반적으로 28.12×18.00mm 핀 헤더 패키지 또는 20.0×14.2mm 금 손가락 패키지를 사용합니다.일부 모듈 제조업체는 20의 더 작은 버전을 출시했습니다.0.0×11.0mm 두 번째 차원은 전력 소비입니다.종료 장치는 태양광 패널 자체에 의해 전원을 공급하고 독립적인 전력 입력이 없습니다. HiSilicon PS0211 솔루션의 정적 전력 소비는 ≤0.15W (그리드에 연결된 경우,패킷을 보내지 않는 국가), 그리고 동적 작동 전력은 ≤0.5W입니다. 햇빛이 충분하지 않은 기간 동안, 모듈이 그림자 또는 밤에있을 때,모듈은 모니터링 기능을 유지하기 위해 매우 낮은 대기 전력 소비에 의존해야 합니다., 인버터 송신기에서 "운동 허용" 신호를 기다립니다. 세 번째 차원은 네트워킹 능력입니다.PLC 신호는 DC 전력 라인을 통해 전송되며, STA 노드 역할을 하는 종료 장치는 인버터 끝에 있는 CCO와 신뢰할 수 있는 통신 링크를 구축해야 합니다.HiSilicon PS0211 솔루션은 전형적인 200 노드에서 10 초 만에 빠른 네트워크를 지원합니다., 2단계 네트워크 시나리오, 동적 라우팅 및 멀티 경로 주소, 유니캐스트, 멀티캐스트 및 방송 명령 전파 방법을 지원합니다.분산형 태양광 시스템의 여러 부품 및 장치에 대한 단일 접근 요구 사항에 대해네트워크 규모와 모듈의 시간 성능은 시스템 시공 효율성에 직접 영향을 미칩니다.. IV. 두 개의 PLC 모듈의 장면 정렬쿼그리시 광전지 차단 PLC 모듈의 선택에서 Qogrisysy는 서로 다른 칩 솔루션을 기반으로 두 가지 제품을 제공하며 각각은 다른 엔지니어링 초점을 대응합니다. S130N-ISI (Linktronics VC6330 솔루션)이 모듈은 LCC 패키지를 사용하며 PCB 크기는 12.6×20.6×2.5mm로 제어됩니다.-20°C~80°C의 온도에서 작동하고 -40°C~125°C의 저장 온도에서 작동합니다., SGCC 0~12MHz 대역폭과 IEEE 1901.1 통신 프로토콜을 지원합니다.매우 제한된 공간의 스위치 장비 설계의 경우 모듈의 물리적 크기가 종종 첫 번째 스크리닝 장애물입니다. 공간이 심각하게 제한되는 급속 정지 단위 (RSU) 장막의 설계에서 모듈의 물리적 크기는 종종 주요 스크리닝 기준으로 사용됩니다.,모듈 수준에서의 엔지니어링 호환성은 특정 칩 매개 변수보다 더 중요합니다.단위는 PV 모듈의 뒷면에 설치되어 있습니다. 매우 제한된 공간의 영역입니다. PV 패널 자체에 의해 공급됩니다., 마이크로 와트 수준의 전력 소모에서 작동하는 동안 PLC 신호를 지속적으로 모니터링 할 필요가 있습니다.그리고 광범위한 온도 범위에서의 신뢰성으로 완전한 RSU가 실제 지붕 환경에서 안정적으로 작동 할 수 있는지 직접 결정합니다.. V. 주요 결론 첫째, PLC는 부품 수준에서 빠른 종료를 위한 최적의 기술 솔루션입니다.썬스펙 사양은 PLC를 통신 신호 운반자로 명시적으로 사용하며 DC 전력 라인을 복합화하여 제어 신호를 전송합니다.따라서 각 구성 요소에 대한 별도의 통신 라인을 설치하는 비용과 신뢰성 위험을 피합니다.. 둘째, 수용 기준은 "기능성"에서 " 측정 가능한 효과"로 바뀌고 있습니다.SJG 220-2026의 30초/80V/30V 사양과 상하이 그룹 표준의 양적 요구 사항은 빠른 종료 솔루션의 설계가 현장 테스트에 견딜 수 있어야 함을 의미합니다. 셋째, 모듈 선택의 핵심 고려 사항은 "칩 매개 변수"에서 "공학 적응력"으로 전환되어야 합니다.세 가지 엔지니어링 지표 켜기 장치의 공간 제한, 자율 전원 상태의 전력 소비 제한분산 시나리오에서 네트워크 규모의 제약은 솔루션이 대량 생산 및 구현 될 수 있는지 여부를 결정하는 열쇠입니다.. 넷째, 인증 수준에 대한 인식은 차단기 제조업체가 구축해야 할 능력입니다.선스펙 프로토콜의 칩 지원, 선스펙을 통한 모듈 인증, UL 1741 안전 표준을 통한 전체 단위 인증은 세 개의 독립적인 검증 수준입니다.Hisilicon PS0211 칩은 명시적으로 SunSpec 표준을 지원합니다., 그리고 이 칩을 기반으로 한 Qogrisysy 3121N-H 모듈은 차단기 제조업체의 전체 단위 인증에 대한 기본적인 프로토콜 수준의 보장을 제공합니다. 다섯째, 모듈 공급업체의 역할은 "장치 공급"에서 "인증 지원"으로 확장되고 있습니다.스위치 제조업체는 단순히 "이용 가능한 모듈"보다 더 많은 것을 필요로 합니다. 그들은 "SunSpec 테스트 논리를 이해하는 데 도움을 줄 수 있는 기술 파트너를 필요로 합니다.그리고 전체 시스템 인증을 통과하는 데 도움이."